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tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 1 toshiba led lamps tlrmh1100a (t11), tlsh1100a (t11), tloh1100a (t11), tlyh1100a (t11) panel circuit indicator surface-mount devices 3.2 (l) 2.8 (w) 1.9 (h) mm flat-top type ingaa ? p leds high luminous intensity low drive current, high-intensity light emission colors: red, orange, yellow reflow soldering possible applications: automotive use, message signboards, backlighting etc. standard embossed tape packing: t11 (2000/reel) 8-mm tape reel color and material unit: mm jedec D jeita D toshiba D weight: 0.035 g (typ.) product name color material tlrmh1100a red tlsh1100a red tloh1100a orange tlyh1100a yellow ingaa ? p
tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 2 maximum ratings (ta 25c) product name forward current i f (ma) reverse voltage v r (v) power dissipation p d (mw) operation temperature t opr (c) storage temperature t stg (c) tlrmh1100a tlsh1100a tloh1100a tlyh1100a 70 4 161 40~110 40~110 electrical characteristics (ta 25c) forward voltage v f reverse current i r product name min typ. max i f max v r tlrmh1100a 1.9 2.3 tlsh1100a 1.9 2.3 tloh1100a 2.0 2.3 tlyh1100a 2.0 2.3 20 10 4 unit v ma a v optical characteristics?1 (ta 25c) luminous intensity i v product name min typ. max i f tlrmh1100a 63 150 tlsh1100a 160 260 tloh1100a 160 270 tlyh1100a 100 220 20 unit mcd ma optical characteristics?2 (ta 25c) emission spectrum peak emission wavelength p dominant wavelength d product name min typ. max typ. min typ. max i f tlrmh1100a 636 17 626 tlsh1100a 623 17 613 tloh1100a 612 15 605 tlyh1100a 590 15 587 20 unit nm nm nm ma note: this visible led lamp also emits some ir light. if a photodetector is located near the led lamp, please ensure that it will not be affected by the ir light.
tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 3 tlrmh1100a relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength ta 25c radiation pattern allowable forward current i f (ma) ambient temperature ta (c) i f ? ta 0 0 20 40 60 80 100 120 80 100 20 40 60 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 1 1 10 100 100 100 10 30 3 300 3 30 0.1 0.5 3 0.3 20 0 20 40 60 80 1 0 580 620 640 660 700 0.2 0.4 0.6 0.8 1.0 i f 20 ma ta 25c 600 680 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10
tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 4 tlsh1100a 0 0 20 40 60 80 100 120 80 100 20 40 60 i f ? v f relative luminous intensity forward voltage v f (v) forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength allowable forward current i f (ma) ambient temperature ta (c) i f ? ta ta 25c radiation pattern 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 1 1 10 100 100 1000 10 300 30 3 3 30 0.1 0.5 3 0.3 20 0 20 40 60 80 1 0 560 600 620 640 680 0.2 0.4 0.6 0.8 1.0 i f 20 ma ta 25c 580 660 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10
tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 5 tloh1100a 0 0 20 40 60 80 100 120 80 100 20 40 60 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength allowable forward current i f (ma) ambient temperature ta (c) i f ? ta 0.1 0.5 3 0.3 20 0 20 40 60 80 1 ta 25c radiation pattern 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 1 1 10 100 1000 10 100 300 30 3 3 30 0 540 580 600 620 660 0.2 0.4 0.6 0.8 1.0 i f 20 ma ta 25c 560 640 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10
tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 6 tlyh1100a 0 0 20 40 60 80 100 120 80 100 20 40 60 i f ? v f relative luminous intensity forward voltage v f (v) forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength allowable forward current i f (ma) ambient temperature ta (c) ) i f ? ta 0.1 0.5 3 0.3 20 0 20 40 60 80 1 0 540 580 600 620 660 0.2 0.4 0.6 0.8 1.0 i f 20 ma ta 25c 560 640 ta 25c radiation pattern 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 1 1 10 100 1000 10 100 300 30 3 3 30 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10
tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 7 packaging these led devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. the optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. this moisture proof bag may be stored unopened within 12 months at the following conditions. temperature: 5 c~30 c humidity: 90% (max) 2. after opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5c to 30c/60% rh or below. 3. if upon opening, the moisture indicator card shows humidity 30% or above (color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. after baking, use the baked devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 12 to 24 hours. expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. if the packing material of laminate would be broken, the hermeticity would deteriorate. therefore, do not throw or drop the packed devices. mounting method soldering reflow soldering please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. second reflow soldering in case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 c, 60% rh max make any necessary soldering corrections manually. (only once at each soldering point) soldering iron : 25 w temperature : 300 c or less time : within 3 s recommended soldering pattern 60~120 s 10 s max 240 c max 4 c/s max 140~160 c 4 c/s max time (s) package surface temperature ( c) temperature profile 1.65 1.15 2.41 unit: mm 1.65
tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 8 cleaning when cleaning is required after soldering, toshiba recommends the following conditions: cleaning solvents : ak225 or alcohol temperature : 50 c (max) for 30 s (max) or 30 c (max) for 3 min (max) ultrasonic : 300 w max precautions when mounting do not apply force to the plastic part of the led under high-temperature conditions. to avoid damaging the led plastic, do not apply friction using a hard material. when installing the pcb in a product, ensure that the device does not come into contact with other cmponents. tape specifications 1. product number format the type of package used for shipment is denoted by a symbol suffix after the product number. the method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard toshiba specifications) (1) tape type: t14 (4-mm pitch) (2) example 2. tape dimensions unit: mm symbol dimension tolerance symbol dimension tolerance d 1.5 0.1/ 0 p 2 2.0 0.05 e 1.75 0.1 w 8.0 0.3 p 0 4.0 0.1 p 4.0 0.1 t 0.3 0.05 a 0 2.9 0.1 f 3.5 0.05 b 0 3.7 0.1 d 1 1.5 0.1 k 0 2.3 0.1 tlsh1100a (t11) tape type toshiba product no. a 0 p d 1 f e w polarity t k 0 b 0 d p 2 p 0
tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 9 3. reel dimensions unit: mm 4. leader and trailer sections of tape note1: empty trailer section note2: empty leader section 9 0.3 180 0 4 60 13 11.4 1.0 2 0.5
44 (note 1) leading part: 190 mm (min) 40 mm or more (note 2) 40 mm or more
tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 10 5. packing display (1) packing quantity reel 2,000 pcs carton 10,000 pcs (2) packing form: each reel is sealed in an aluminum pack with silica gel. 6. label format (1) example: tlsh1100a (t11) p/n: type tlsh1100a add.c (t11) q?ty 2,000 pcs note lot number (rank symbol) (2) label location tape feel direction label position label position reel carton the aluminum package in which the reel is supplied also has the label attached to center of one side.
tl(rmh,sh,oh,yh)1100a(t11) 2001-12-05 11 toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc.. the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. gallium arsenide (gaas) is a substance used in the products described in this document. gaas dust and fumes are toxic. do not break, cut or pulverize the product, or use chemicals to dissolve them. when disposing of the products, follow the appropriate regulations. do not dispose of the products with other industrial waste or with domestic garbage. the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others. the information contained herein is subject to change without notice. 000707eac restrictions on product use

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